产品与市场
S1190
特点
● 耐CAF
● 优异的耐热性
● 优异通孔可靠性
应用领域
● 适用于厚铜板或者>24L的多层PCB- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 200 | |
| Tg |
|
TMA |
℃ |
170 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 350 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 45 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.5E+08 | |
| E-24/125 | MΩ.cm | 1.9E+06 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 3.3E+07 | |
| E-24/125 | MΩ | 2.4E+06 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 146 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.6 | |
|
IPC-TM-650 2.5.5.9 |
1MHz | -- | 4.8 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.015 | |
|
IPC-TM-650 2.5.5.9 |
1MHz | -- | 0.009 | ||
| Peel Strength (1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm[lb/in] | 1.25[7.14] | |||
| 125℃ | N/mm | — | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 530 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 410 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.07 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. Specification sheet: IPC-4101/126, is for your reference only.
2. All the typical value is based on the 1.6mm(16*2116) specimen.
3. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights fromthis data sheet are reserved by Shengyi Technology Co., Ltd.