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| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | — | |
| After Tg | ppm/℃ | — | |||
| 50-260℃ | % | 6.2 | |||
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder float | -- | 30s No delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 7.8 x 108 | |
| E-24/125 | MΩ.cm | 2.9 x 105 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 5.6 x 107 | |
| E-24/125 | MΩ | 2.8 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 118 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.4 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.022 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength(1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.8 | |||
| 125℃ | N/mm | 1.6 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 420 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 358 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.13 | |
| CTI | IEC60112 | A | Rating | PLC2 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. Specification sheet: IPC-4101/10, is for your reference only.
2. All the typical value is based on the 1.6mm specimen.
3. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.