Product
SML02G
Characteristic
● HighTg >170℃ (DSC),Halogen Free
● LowerX/Y-axis CTE (<13ppm),offering superior PTH reliability
● Lowerinsertion loss, Dk/Df@10GHz:4.24/0.069
● ExcellentAnti-CAF performance
Application Area
Improve solderingreliability with large sockets, can be used in server, switch, base station.
- Product Performance
- Product Certificate
- Data Download
Items | Method | Condition | Unit | Typical Value | |
---|---|---|---|---|---|
Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | |
|
|
DSC |
℃ |
175 | |
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 420 | |
CTE (X/Y-axis) | IPC-TM-650 2.4.24.5 | 50-125℃ | ppm/℃ | 11-13 | |
CTE (Z-axis) |
IPC-TM-650 2.4.24 |
Before Tg |
ppm/℃ |
25 | |
After Tg | ppm/℃ | 125 | |||
50 |
% | 1.2 | |||
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | min | PASS | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 3.76 x 107 | |
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 4.16 x 107 | |
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 180 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
Dissipation Constant (Dk) |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.15 | |
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 4.24 | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0053 | |
IPC-TM-650 2.5.5.5 |
10GHz |
-- |
0.0069 |
||
Peel Strength (1Oz) | IPC-TM-650 2.4.8 | After thermal Stress 288℃,10s | N/mm | 1.00 | |
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 |
CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.07 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Remarks:
Remarks:
1. Specification sheet: IPC-4101/130, is for your reference only.
2. The typical CTE value is based on specimen with 2116, whilethe Tg is for specimen≥0.50mm.
3. All the typical values listed aboveare for your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.