Product
SF325B
Characteristic
● High bondingstrength
● Halogen free,Flammability UL94 VTM-0.
● Excellent solderingreliability, chemical resistance and electrical properties.
● Excellent anti-ionMigration, no dendrite.
● Low adhesiveflowing, good processability, suitable for both fast and traditional laminationstyle.
● Compatible with EU RoHS directive, free of Pb,Hg,Cd,Cr6+,PBB,PBDE, etc..
Application Area
Multi-layer FPC and rigid-flex PCB, etc..- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.4 |
| 288℃、5s | 1.3 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % | 96.2 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 8.0×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ | 8.5×106 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 3.4 |
| Dissipation Factor(10GHz) | SPDR | C-24/23/50 | - | 0.017 |
| Resin Flow | IPC-TM-650 2.3.17.1 | 180℃/10+60s,100kg/cm2 | mm | ＜0.15 |
| Flammability | UL94 | E-24/125 | Rating | VTM-0 |
Remarks:
*Testing after laminating with shining side of copper foil and PI film insuitable condition.
1.Certified to IPC-4203/20 Unsupportedpolyester adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.