Product
SF315B
Characteristic
● High bonding strength, gooddimensional stability.
● Excellent solderingreliability, chemical resistance and electrical properties.
● Low adhesive flowing, good processability,suitable for both fast and traditional laminationstyle.
● Compatible with EU RoHS directive, free of Pb,Hg,Cd,Cr6+,PBB,PBDE,etc.
Application Area
Multi-layer FPC and rigid-flex PCB, etc..
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.0 |
| 288℃、5s | 0.9 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - |
No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞90 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 100 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
2.51×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
1.02×105 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 3.4 |
| Dissipation Factor(10GHz) | SPDR |
C-24/23/50 |
- | 0.02 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | ＜0.15 |
Remarks:
*Testing after laminating with shining side of copper foil and PI film insuitable condition.
1.Certified to IPC-4203/19 unsupported epoxy adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.