Product
SF202C
Characteristic
● Excellentanti-ion-migration performance.
● Excellent thermal agingresistance
● Flammability UL94 VTM-0.
● Low Dk & Low Df at highfrequency
● Low adhesive flowing, good processability,suitable for both fast andtraditional lamination style.
● Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
For security, high reliability requirements of electronic products.
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 0.8 |
| 288℃、5s | 0.8 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - | No delamination |
| Dimensional Stability | SY Method | After peeling off the paper | % | 0.0270/0.0030 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % | ＞90 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 8×108 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ | 2×105 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 3.2 |
| Dissipation Factor(10GHz) | SPDR | C-24/23/50 | - | 0.008 |
| Resin Flow | IPC-TM-650 2.3.17.1 | 180℃/10+60s,100kg/cm2 | mm | ＜0.15 |
| Flammability | UL94 | E-24/125 | Rating | V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition
1.Certified to IPC-4203/21 Poyimide dielectric withpolyimide adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.