Product and Market
Select product series
Please select a product series
Please select product category
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity(W/m·K)
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- S7045G
- Mid-loss, HFR-free, FR4.1 Multilayer Used PCB Base Material
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- 4.30
- 0.010
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- SML02G
- High Tg, Low CTE, Mid-Loss Multilayer Material
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- 4.24
- 0.0069
- 1.1%
- 175
- 410
- S7045GH
- Halogen-free, High Reliability & Mid Loss Material
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- 3.95
- 0.0095
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- S7040G
- Mid-loss, HFR-free Multilayer PCB Used Base Material
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- 3.72
- 0.0089
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- S7439C
- Low-loss HSD PCB Used Multilayer Base Material
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- 3.66
- 0.0060
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- S7439
- Low-loss HSD PCB Used Multilayer PCB Material
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- 3.66
- 0.0060
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- S7439G
- Low-loss, HFR-free, HSD PCB Used Multilayer Base Material
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- 3.74
- 0.0060
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- Synamic 6GX
- Very low-loss, HFR-free, HSD PCB Used Base Material
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- 3.73
- 0.0050
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- Synamic 6
- Very low-loss HSD PCB Used Base Material
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- 3.68
- 0.0036
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- Synamic 6N
- Ultra-low loss HSD PCB Used Multilayer Base Material
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- 3.35
- 0.0021
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